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    Laser structuring of flexible circuit board
    Laser structuring of flexible circuit board
    The UV laser device imported from Germany adopts UV-DPSS laser device,being able to process FPC structuring,FPC micropore drilling,FPC blind hole drilling,high polymer material cutting ,LTCC low temperature Co-fired ceramic circuit board cutting and drilling,application of high-precise component structuring and so on. The technology application process is automatic during the whole process,owning the characteristic of being high-precise,high-efficient,high-quality,low carbon and environment friendly,setting a precedent in the innovation of UV laser application technology.
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    • Address:12/F, Block A, Jindi Century Building, Qiaoxiang Road, Nanshan District, Shenzhen
    • Tel:0755-2698 1000
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